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Microelectronics

This series of information sheets will help those working with microelectronics to comply with their duties under the Control of Substances Hazardous to Health Regulations 2002 (as amended) to control exposure to hazardous substances and protect workers' health.

Microelectronics [MC]

MC0: Advice for managers

  • MC0: Advice for managers Advice for managersThis information will help managers to comply with the Control of Substances Hazardous to Health Regulations 2002 (COSHH), as amended, to control exposure and protect workers’ health.

MC1: Wet etch processing

  • MC1: Wet etch processing Wet etch processingThis sheet describes good practice using containment where possible, or engineering control (local extraction or an extracted booth). It covers the points you need to follow to reduce exposure to an adequate level. It is important to follow all the points, or use equally effective measures.

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MC2: Chemical Vapour Deposition (CVD)

  • MC2: Chemical Vapour
Deposition (CVD) Chemical Vapour Deposition (CVD)This sheet describes good practice using containment, with extraction for product removal, and covers the points you need to follow to reduce exposure to an adequate level. It covers daily and weekly routine tasks of operation and maintenance. It does not cover major maintenance tasks or decommissioning of used equipment. It is important to follow all the points on the sheet, or use equally effective measures.

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MC3: Dry etch processing

  • MC3: Dry etch processing Dry etch processingThis sheet describes good practice using containment, with extraction for product removal, and covers the points you need to follow to reduce exposure to an adequate level. It covers daily and weekly routine tasks of operation and maintenance. It does not cover major maintenance tasks or decommissioning of used equipment. It is important to follow all the points on the sheet, or use equally effective measures.

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MC4: Molecular beam epitaxy

  • MC4: Molecular beam epitaxy Molecular beam epitaxyThis sheet describes good practice using containment, with extraction for product removal, and covers the points you need to follow to reduce exposure to an adequate level. It covers daily and weekly routine tasks of operation and maintenance. It does not cover major maintenance tasks or decommissioning of used equipment. It is important to follow all the points on the sheet, or use equally effective measures.

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MC5: Photolithography processing

  • MC5: Photolithography
processing Photolithography processingThis sheet describes good practice using containment, with extraction for product removal, and covers the points you need to follow to reduce exposure to an adequate level. It covers daily and weekly routine tasks of operation and maintenance. It does not cover major maintenance tasks or decommissioning of used equipment. It is important to follow all the points on the sheet, or use equally effective measures.

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MC6: Ion implantation

  • MC6: Ion implantation Ion implantationThis sheet describes good practice using containment, with extraction, and covers the points you need to follow to reduce exposure to an adequate level. It is important to follow all the points on the sheet, or use equally effective measures.

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2015-02-04